Introduction to Toa Electronics' Wet Process Business
Technological capabilities that contribute to the development and practical application of advanced materials.
We propose a surface treatment device that condenses our unique manufacturing technology. In recent years, with the increasing complexity of three major categories of circuits—flexible printed circuits (FPC), rigid printed circuits, and packages—we handle various surface treatment devices such as plating equipment, developing, etching, and stripping devices (DES), and cleaning equipment that respond to the trends of high density and miniaturization. We accommodate a wide range of wet processes, from subtractive methods (etching) to additive methods (plating), including SAP and MSAP, tailored to customer needs and processes such as substrate material, thickness, effective treatment width, treatment thickness, and transport speed. We will propose the optimal equipment configuration according to the application and processing accuracy. We take full responsibility for the design, manufacturing, assembly, installation, and maintenance of various devices.
- 企業：トーア電子
- 価格：Other
